2.5D / 3D Packaging
![](https://www.tek.com/-/media/images/services/component-solutions/25d-3d-packaging/25d-package-crosssection.png?h=480&iar=0&w=600)
![](https://incompliancemag.com/wp-content/uploads/2023/02/2303_C2_ESD_fig1.png)
ESD Challenges in 2.5D/3D Integration - In Compliance Magazine
![](https://www.3dincites.com/wp-content/uploads/Figure1-14-1024x879.png)
Chiplet Design and Heterogeneous Integration Packaging - 3D InCites
IEEE IRPS - IRPS 2018 Focus session on 3D Integration and Advanced Packaging With diminishing returns from traditional transistor scaling further improvements in power and performance of
2.5D vs. 3D Packaging, Advanced PCB Design Blog
![](https://oricus-semicon.com/wp-content/uploads/2021/11/25.png)
What are the Advanced Packaging Technologies?
![](https://d3i71xaburhd42.cloudfront.net/368975a69ac87bf234fba367d247659ca5b1fe18/1-Figure2-1.png)
Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration
![](https://bakirlab.gatech.edu/sites/default/files/%5BResearch%20areas%5D/HIST.jpg)
Heterogeneous Integration (2.5D and 3D)
![](https://images.anandtech.com/doci/17626/3DFabric-Alliance_678x452.jpg)
TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D Chiplet Products
![](https://www.indium.com/assets/images/applications/semiconductor-packaging/second-level-interconnect.jpg)
2.5D & 3D Packaging, Applications
Challenges in Predicting Thermal Integrity of 2.5D and 3D-ICs
![](https://www.mdpi.com/micromachines/micromachines-14-01531/article_deploy/html/images/micromachines-14-01531-g001.png)
Micromachines, Free Full-Text
2.5D vs. 3D Packaging, Advanced PCB Design Blog
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Semicap Primer: Packaging History and Primer
![](https://media.springernature.com/lw685/springer-static/image/chp%3A10.1007%2F978-3-030-85792-9_6/MediaObjects/503530_1_En_6_Fig1_HTML.png)
Heterogeneous 2.5D and 3D Integration for Securing Hardware and Data
![](http://electroiq.com/insights-from-leading-edge/wp-content/uploads/sites/4/2014/04/fig-3-SCP-1024x453.jpg)
April, 2014