2.5D / 3D Packaging

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ESD Challenges in 2.5D/3D Integration - In Compliance Magazine

Chiplet Design and Heterogeneous Integration Packaging - 3D InCites

IEEE IRPS - IRPS 2018 Focus session on 3D Integration and Advanced Packaging With diminishing returns from traditional transistor scaling further improvements in power and performance of

2.5D vs. 3D Packaging, Advanced PCB Design Blog

What are the Advanced Packaging Technologies?

Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration

Heterogeneous Integration (2.5D and 3D)

TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D Chiplet Products

2.5D & 3D Packaging, Applications

Challenges in Predicting Thermal Integrity of 2.5D and 3D-ICs

Micromachines, Free Full-Text

2.5D vs. 3D Packaging, Advanced PCB Design Blog

Semicap Primer: Packaging History and Primer

Heterogeneous 2.5D and 3D Integration for Securing Hardware and Data

April, 2014